Some pharmaceutical compounds namely valsartan, hydrocholorothiazide, erythromycin thiocynate and diclofenac potassium were studied as chemical additions for enhancing the finished C-steel surface attained. Anode potential–limiting current relationship was measured and comparing of gradually increasing pharmaceutical compound concentrations (1 × 10–4–7 × 10–4 M) and weight loss method. C‑steel dissolution behavior in presence of pharmaceutical compounds was studied under natural convection and (rotating cylinder (RCE) and rotating disc electrode (RDE) as forced convection. The rotation speed of RCE and RDE was studied. The limiting current was found to diminishes with enlarging additives concentration and increase with increasing temperature (293–313 K). Activation energies values confirm that reaction rate was diffusion controlled. Results showed that the improvement produced in electropolishing in presence of pharmaceutical compounds occurs through adsorption of their molecules above metal surface. Pharmaceutical compound adsorption obey kinetic–thermodynamic model. Retardation percentage obtained from weight loss measurement are comparable with those obtained from galvanostatic polarization measurements. The data under different conditions were controlled by dimensionless correlations Sherwood (Sh), Schmidt (Sc) and Reynolds (Re) numbers. Surface morphology study confirmed that addition of pharmaceutical compound to C-steel dissolution bath enhance surface appearance and its texture quality to great extent.